



Applicable Scenarios:
Electronic clean room, semiconductor factory, data center, precision instrument workshop, chemical explosion-proof area, operating room
Coating Thickness: 2-3mm
Core Features:
Electrostatic dissipation type, surface resistance 10⁶-10⁹Ω, environmentally friendly and odorless, suitable for precision electronics / explosion-proof scenarios
Key Technical Parameters:
Compressive strength ≥ 45MPa, tensile strength ≥ 10MPa, system grounding resistance ≤ 10Ω, no abnormalities after exposure to 20% acid and alkali for 60 hours
surface effect:
The seamless, smooth, and easy-to-clean coating achieves electrostatic dissipation by constructing a conductive coating + copper foil network
| Performance Indicator | Technical Requirement |
|---|---|
| Compressive Strength (28d) | ≥50 MPa |
| Tensile Strength | ≥10 MPa |
| Wear Resistance (750g/500r) | ≤35 mg |
| Leveling Property (mm) | ≥180 |
| Chemical Resistance | Resists immersion in 20% acids/bases and motor oil for 60h without deterioration |
| Adhesion (Pull-off, MPa) | ≥3.2 MPa (Substrate failure) |
| Curing Time (25℃) | Surface dry ≤6h, hard dry ≤36h, full cure 10d |
| Surface Resistance (Ω) | 10⁶ - 10⁹ (Electrostatic Dissipative) |
| System Grounding Resistance (Ω) | ≤10 Ω |







